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RELIFE RL-404 Lead-Free Low-Temp Solder Paste, 138°C for Phone PCB BGA/SMD Repair
RELIFE RL-404 Lead-Free Low-Temp Solder Paste, 138°C for Phone PCB BGA/SMD Repair
Regular price
$10.99 USD
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$0.00 USD
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$10.99 USD
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Features:
- Designed to meet the maintenance requirements of high-end Huawei and Apple motherboards.
- Specially formulated low temperature lead-free solder paste for high-end motherboard repair.
- Features RL-404 with an impressive 138°C low melting point.
Specification:
Model Number: RL-404
Melting Point: 138°C
Weight: 40g
Package Includes:
- 1 x Tin Paste
